Chip demand is doubling every four years, driven by AI, 5G and electrified transport. The industry’s horizon is defined by smaller nodes, larger wafers and ever-tighter contamination budgets—all demanding materials that stay dimensionally stable above 1,000 °C yet add almost zero metallic contamination.
Carbon surfaces provide a clean, thermally uniform cradle for silicon. Graphite susceptors carry 300 mm wafers through epitaxy and ion implant; CVD SiC-coated pedestals survive aggressive fluorine plasmas without particle shedding; rigid carbon-composite end-effectors move dies at sub-millimetre accuracy without adding magnetic mass. Chemically inert and isothermally stable, these carbon components let fabs push geometry and purity to the atomic scale.
From ultra-pure graphite susceptors to SiC-coated wafer boats, Harog Technology delivers the carbon precision that keeps Moore’s Law alive—turning silicon into the semiconductors that power tomorrow’s connected world.
